Global SMT & Packaging International Digital Magazine

Global SMT June 2018 (18.06)

Global SMT & Packaging is THE assembly journal for electronics manufacturers worldwide.

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Volume 18 • Number 6 • June 2018 • ISSN 1474 –0893 www.globalsmt.net The Global Assembly Journal for SMT & Advanced Packaging Professionals INTERVIEW INSIDE Ros Berntson, Indium Corporation INTERVIEW INSIDE Ros Berntson, Indium Corporation SMT Hybrid Packaging 2018 NEPCON China – the Race to Automate Improving Thermal Cycling Behavior of QFNs with the Soldering Alloy Improving Consistency and Quality with Automatic Solder Nozzle Tinning

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