Global SMT & Packaging International Digital Magazine

Global SMT January 2017 (17.1)

Global SMT & Packaging is THE assembly journal for electronics manufacturers worldwide.

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Volume 17 • Number 1 • January 2017 • ISSN 1474 –0893 www.globalsmt.net Bernhard Mürkens Interview Inside Programmed for Success – Suppliers as Partners Successfully Navigating the Nearshore Movement Metallic TIM Testing and Selection for IC, Power, and RF Semiconductors The Influence of Ionic Contamination Programmed for Success – Suppliers as Partners Successfully Navigating the Nearshore Movement Metallic TIM Testing and Selection for IC, Power, and RF Semiconductors The Influence of Ionic Contamination The Global Assembly Journal for SMT & Advanced Packaging Professionals The Global Assembly Journal for SMT & Advanced Packaging Professionals The Global Assembly Journal for SMT & Advanced Packaging Professionals

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