Global SMT & Packaging magazine for electronics manufacturing, enters it’s 17th year providing the latest technology, process tips and industry news to professionals in the surface mount and advanced packaging industry. Global SMT & Packaging is the world’s leading B2B magazine for electronics assembly and advanced packaging professionals with editions in Europe, US, China and Southeast Asia. With three editions (International, China and Southeast Asia) and five websites (International; China; Southeast Asia; Germany, Austria, Switzerland; UK and Ireland). The magazines, websites and newsletters offer solution-led technical articles, business forecasts, insightful columns, coverage of industry news, new products and events.
Global SMT & Packaging is the global reference to learn about the latest technology and process improvements to make your job easier, faster, more reliable and profitable! With magazines, websites, newsletters and video programs, provided by our global team to editors and contributors, we provide the gold standard for technical reporting in the electronics manufacturing industry. Global SMT & Packaging magazine covers all industry sectors involved in electronics assembly such as Aerospace, Telecommunications, Consumer, Industrial, Military, Medical and reports on the latest emerging technologies such as wearables, renewable energy, LEDs and OLEDs. In addition, each issue focuses on the latest manufacturing systems, processes and techniques, including Industry 4.0, Factory 1.0 (China) and other IoM (Internet of Manufacturing) technologies.