Global SMT May 2018 (18.05)

April 23, 2018

Getting Ready for a Busy Show Season

No sooner is APEX behind us than preparations start in earnest for a string of Spring shows and events.

As I write this editorial, NEPCON Shanghai looms on the horizon next week. The Hermes Standard will be making their official Asia debut, having added a large number of participating suppliers since Productronica. Rumors suggest that over 50 companies now adhere to The Hermes Standard. In Shanghai, they will be announcing the latest developments and no doubt we will be hearing similar overtures from the IPC CfX Standard, which was launched with such fanfare at APEX in February.

Following Nepcon Shanghai, Global SMT & Packaging will be hosting its own one-day eSmartFactory conference is in Sunnyvale, CA on May 24th in association with SMTA. This one day event in the heart of Silicon Valley has attracted a number of excellent presentations by some of the leading thought leaders in the industry. Be sure and join us!

 

It has been an extremely busy first half of the year and Global SMT & Packaging continues to bring you the latest news, trends and technologies from around the world.

 

In June, we will be heading over to Europe for SMT/Hybrid/Packaging. This is the most consistently successful annual event in the European calendar and early indications are that this year will be no exception. Global SMT & Packaging will be broadcasting a range of in-depth panel discussions on a variety of topics affecting the industry.

July 7th is the deadline for our world famous Global Technology Awards 2018. This event highlights the very best innovations from the previous 12 months and this year the winners will be celebrated at our Awards ceremony at SMTAi in Rosemont IL in October.

The final event to round out the first half of the year is Semicon West in CA. Last year, this event started to exhibit a new lease of life on the back of the increasing using of automation and Artificial Intelligence in the industry. As backend packaging moves towards 7nm and 5nm nodes, there is plenty of packaging related issues that still need to be resolved.

It has been an extremely busy first half of the year and Global SMT & Packaging continues to bring you the latest news, trends and technologies from around the world. Walt Custer’s numbers seem to suggest that there is no end in sight yet for the current growth in electronics manufacturing activity, so I guess we need to all keep our heads down and make hay while the sun shines! 

– Trevor Galbraith Editor-in-Chief 

editor@globalsmt.net

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